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EMMA Expo India
Moldex3D is glad to announce that we will exhibit at EMMA Expo India on September 11-13, 2014 in Bangalore. At this Expo, we will demonstrate our latest Moldex3D simulation developments, discuss...
View ArticleCoreTech System Announces Moldex3D R13.0: Best-in-class Industry-oriented...
Hsinchu, Taiwan – Jun 27, 2014 – CoreTech System Co., Ltd. (Moldex3D), the global leading innovator of True 3D CAE simulation solutions, announced the release of Moldex3D R13.0. The software has...
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Plastomotive 2014
Moldex3D is pleased to announce that we will be co-sponsoring Plastomotive 2014 with our long-time alliance partner, PTC® Creo®. The conference will held from August 19-20, 2014 at Hotel Hyatt Regency...
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FOAMS® 2014
CoreTech System (Moldex3D) will be presenting at FOAMS® 2014, the 12th International Conference on Foam Materials & Technology, September 8-11 in New Jersey. CoreTech System (Moldex3D) will be...
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The 14th-annual SPE Automotive Composites Conference & Exhibition (ACCE)
CoreTech System (Moldex3D) is pleased to announce its upcoming participation at SPE ACCE 2014 held in The Diamond Banquet & Conference Center at the Suburban Collection Showplace, Novi, Michigan...
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Moldex3D Global Innovation Talent Award Winner’s Interview Series- Business...
Read the full winning entry Browse 2013 winners’ gallery Q: How do you feel about winning the 2013 Moldex3D Global Innovation Talent Award Contest? Evrim Metin: When we decided to attend this...
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Moldex3D IC Packaging Integration for Cadence
EDA tools that perform physical layout-IC, IC package, or PCB- are generally two dimensional and may work fine for substrate layout, interconnect planning, or metal fill creation. Toward the design...
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Leverage Moldex3D Designer BLM to Maximize Meshing Efficiency
Moldex3D Designer BLM mode is designed to help designers enhance mesh quality with less complex and faster workflow. The BLM technology can generate high quality meshes for parts, runners and cooling...
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Leading Battery Manufacturer Makes Smarter Design Decisions with Moldex3D
Leading Battery Manufacturer Makes Smarter Design Decisions with Moldex3D Customer Profile Customer: RAMCAR Technology Inc. Industry: Automotive industry Solution: Moldex3D Advanced Country:...
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User’s Meeting Germany
Always being up-to-date, following the latest research results and developments within the plastics industry and integrating them into software and range of services is one of SimpaTec’s, our partner...
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Interplas 2014
Interplas is the UK’s largest plastics industry exhibition and the only event to cover all of the manufacturing processes, technologies and services within the plastics industry. Make sure to stop by...
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International Conference on Polymers and Moulds Innovations – PMI2014
Conference History Since 2005 the International Conference on Polymers and Moulds Innovations (PMI 2014) has been organized biannually in cooperation between the Institute for Polymers and Composites...
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Plast Eurasia 2014
PLAST EURASIA İSTANBUL, the international platform of the plastics industry has been growing annually by the number of exhibiting companies and the well-qualified visitors. The plastic industry of...
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American Society for Composites 29th Technical Conference
CoreTech System (Moldex3D) will be presenting at ASC 29th Technical Conference, September 8-10 at Price Center, University of California San Diego, La Jolla, CA USA. CoreTech System (Moldex3D) will be...
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International Engineering Fair 2014
The International Engineering Fair (MSV) is the leading industrial trade fair in Central Europe with annual participation reaching more than 1500 exhibitors and 75000 visitors from 59 countries...
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7th Digimat Global Users’ Conference & Training
Tools, Solutions and Expertise for the end-to-end analysis of Chopped and Continuous Fiber Composite Materials and Structures e-Xstream engineering is pleased to announce the organization of the 7th...
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Lunch & Learn on Moldex3D R13.0 Series
Available Dates: September 23th, September 24th Where: Moldex3D Northern America, Inc. 27725 Stansbury blvd Suite 190, Farmington Hills Mi 48334 Cost: FREE This event is designed to review and give...
View ArticleMoldex3D Unveils New IC Packaging Simulation Solutions at SEMICON Taiwan 2014
August 25, 2014- Hsinchu, Taiwan- CoreTech System (Moldex3D) is going to exhibit the latest suite of simulation solutions for IC Packaging at “Semicon Taiwan 2014” from September 3 to September 5, 2014...
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Moldex3D User’s Meeting Portugal
From our very first user in Europe, throughout more than a decade of cooperation, SimulFlow evolved into one of our best partners in Europe. Years of hard work, excellent customer support and...
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