Join us for a one-day workshop, held at the STATS ChipPAC Inc. in Fremont, CA, on Wednesday, July 19, 2017, where Moldex3D experts will walk you through Moldex3D’s simulation capabilities that can address critical challenges in plastic molding processes, such as warpage, surface defects or composite lightweighting. The workshop will also feature real-world case studies, presented by companies who have successfully and practically applied Moldex3D’s simulation technologies to predict potential defects, optimize design and process parameters, and improve manufacturability of designs. This is a FREE event and spots are limited!
Agenda
| Time | Topic | Presenter |
| 1:00 – 1:30 | Registration | |
| 1:30 – 2:00 | Moldex3D’s Vision and R&D Plan for Injection Molding | Moldex3D |
| 2:00 – 2:30 | An Overview of Carbon Fiber Manufacturing Modeling in LS-DYNA | LSTC |
| 2:30 – 3:00 | Efficient Design and Analysis of Fiber Reinforced Plastic Parts Using Digimat-RP/Moldex3D | e-Xstream Engineering |
| 3:00 – 3:15 | Break | |
| 3:15 – 3:45 | Moldex3D’s Latest Achievements on Warpage Predictions | Moldex3D |
| 3:45 – 4:15 | Effective Design Validation for 3D Printed Injection Molds | Stratasys |
| 4:15 – 5:00 | Moldex3D Demo | Moldex3D |
LocationSTATS ChipPAC Inc. |
ContactKiki Kratzer |
Registration
We will also have a morning session for IC Packaging solutions (see agenda here) on the same day and same location. If you are interested in joining the morning session, please select “Full Day.”
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