Join us for a one-day workshop, held at the STATS ChipPAC Inc. in Fremont, CA, on Wednesday, July 19, 2017, where Moldex3D experts will walk you through Moldex3D’s simulation capabilities that can address critical challenges in both IC packaging and injection molding industry.
The workshop will also feature real-world case studies, presented by companies who have successfully and practically applied Moldex3D’s simulation technologies to predict potential defects, optimize design and process parameters, and improve manufacturability of designs.
Register today to learn about the advanced simulation technology Moldex3D offers to handle your IC packaging or injection molding challenges!
Agenda
Coming Soon!
Location
STATS ChipPAC Inc.
46429 Landing Parkway
Fremont, CA 94538 USA
Tel: 510-979-8000
Fax: 510-979-8001
Event Contact
Kiki Kratzer
T:248-946-4570 ext. 327
E: kikikratzer@us.moldex3d.com
Registration
[contact-form-7]